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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 tsz22111 ? 14 ? 001 www.rohm.com general purpose cmos logic ic single 2-input and gate bu4 s81 g2 general description the bu4s81g2 is a 2-input single and gate with buffered output. buffered output improves the characteristics of propagation delay from gate input to output. also, buffered output suppress the fluctuating delay time which caused by output load capacitance. features ? low power consumption ? high noise immunity ? wide operating supply voltage range ? high input impedance ? high fan out ? input can be directly driven 2 l-ttl inputs or 1 ls- ttl ? buffered output pin configurations key specifications ? supply voltage range: +3v to +16v ? input voltage range: v ss to v dd ? operating temperature range: - 40 c to +85c packages w(typ) x d(typ) x h(max) ssop5 2.90mm x 2.80mm x 1.25mm pin descriptions truth table p in no. symbol i/o function 1 a i input 2 b i input 3 vss - ground 4 y o output 5 vdd - power supply input output a b y l l l l h l h l l h h h y vdd vss b a 1 2 3 5 4 (top view) ssop5 datashee t downloaded from: http:///
2/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 absolute maximum ratings (t a =25 c) (note 1) derate by 5.4mw/c when operating above t a =25c (when mounted o n rohms standard board ). caution: operating the ic over the absolute maximum ratings may damage th e ic. the damage can either be a short circuit between pins or an open circui t between pins and the internal circuitry. therefore, it is important to c onsider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions (t a =- 40 c to +85c) parameter symbol rating unit supply voltage v dd -0.3 to +18.0 v input voltage v in (v ss -0.3) to (v dd +0.3) v input current i in 10 ma operating temperature t opr - 40 to + 85 c storage temperature t stg - 55 to + 150 c maximum junction temperature t jmax + 150 c power dissipation p d 0.67 (note 1) w parameter symbol rating unit supply voltage v dd +3.0 to +16.0 v input voltage v in v ss to v dd v downloaded from: http:///
3/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 electrical characteristics (unless otherwise specified , v ss =0v, t a =25c) dc characteristics parameter symbol limits unit conditions figure no. min typ max v dd [v] input h voltage v ih 3.5 - - v 5 v out =4.5v 2 7.0 - - 10 v out =9.0v 3 11.0 - - 15 v out =13.5v 4 input l voltage v il - - 1.5 v 5 v out =0.5v 2 - - 3.0 10 v out =1 .0v 3 - - 4.0 15 v out =1.5v 4 input h current i ih - - 0.3 a 15 v ih =15v - input l current i il - - -0.3 a 15 v il =0v - output h voltage v oh 4.95 - - v 5 ii out |<1a v in =v dd 2 9.95 - - 10 3 14.95 - - 15 4 output l voltage v ol - - 0.05 v 5 |i out |<1a v in =v ss 2 - - 0.05 10 3 - - 0.05 15 4 output h current i oh - 0.51 - - ma 5 v oh =4.6v v in =v dd 5 -2.1 - - 5 v oh =2 .5 v - 1. 3 - - 10 v oh =9.5v -3.4 - - 15 v oh = 13 .5v output l current i ol 0.51 - - ma 5 v ol =0.4v v in =v ss 6 1. 3 - - 10 v ol =0.5v 3. 4 - - 15 v ol =1.5v quiescent supply current i dd - - 0.25 a 5 v in =v dd - - - 0.5 10 - - 1.0 15 switching characteristics parameter symbol limits unit conditions figure no . min typ max v dd [v] out put rising time t tlh - 70 - ns 5 c l =50pf 7 - 35 - 10 - 30 - 15 out put falling time t thl - 70 - ns 5 c l =50pf 8 - 35 - 10 - 30 - 15 l to h propagation delay time t p lh - 90 - ns 5 c l =50pf 9 - 45 - 10 - 30 - 15 h to l propagation delay time t p hl - 90 - ns 5 c l =50pf 10 - 45 - 10 - 30 - 15 input capacitance c in - 5 - pf - - - downloaded from: http:///
4/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 test circuits v v ih v out 1 . v ih v v o ut 2 . v il v v oh 3 . v oh 4 . v ol i oh 5 . i oh 6 . i ol i o ut a v oh i ol a v ol v in v in v in v in v il v dd v dd v dd v dd v dd v dd v v ol i out description of symbols t p hl : time from 50% of the fall edge of input waveform to 50% o f the fall edge of output waveform t p lh : time from 50% of the rise edge of input waveform to 50% of the rise edge of output waveform t thl : time from 90% to 10% of fall edge of output waveform t tlh : time from 10% to 90% of rise edge of output waveform + o ut i + input output c l =50pf 7 . t tlh , t thl , t plh , t phl input v dd output + + + + i o ut 20 ns 20 ns 90 % 50 % 10 % 90 % 50 % 10 % t p hl t t lh t t hl t p lh downloaded from: http:///
5/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 typical performance curves figure 2 . output voltage vs input voltage >& v dd =5v / v ss =0v >' figure 3 . output voltage vs input voltage >& v dd =10v / v ss =0v >' figure 4 . output voltage vs input voltage >& v dd =15v / v ss =0v >' figure 1 . output voltage vs input voltage >& v dd =3v / v ss =0v >' 0 1 2 3 4 0 1 2 3 output voltage [v] input voltage [v] 85 c 25 c - 40 c 0 1 2 3 4 5 6 0 1 2 3 4 5 output voltage [v] input voltage [v] 85 c 25 c - 40 c 0 2 4 6 8 10 12 0 2 4 6 8 10 output voltage [v] input voltage [v] 85 c 25 c - 40 c 0 5 10 15 20 0 5 10 15 output voltage [v] input voltage [v] 85 c 25 c - 40 c downloaded from: http:///
6/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 typical performance curves - continued figure 5 . out put h current vs output voltage figure 6. output l current vs output voltage -50 -40 -30 -20 -10 0 0 5 10 15 20 output source current [ma] output voltage [v] v dd =1 5v 85 c 25 c - 40 c v dd =10v 85 c 25 c - 40 c v dd = 5v 85 c 25 c - 40 c v dd =3v 85 c 25 c - 40 c 0 10 20 30 40 50 60 70 0 5 10 15 20 output sink current [ma] output voltage [v] v dd =5v - 40 c + 25 c + 85 c v dd =3v - 40 c + 25 c + 85 c + 85 c v dd =15v +25c - 40 c - 40 c + 85 c v dd =1 0v +25c figure 7 . out put rising time t tlh 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] output rise time [ns] operating temperature range v dd =3v v dd =5v v dd =16v v dd =10v figure 8 . out put falling time t thl 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] output fall time [ns] v dd =3v v dd =5v v dd =16v v dd =10v operating temperature range downloaded from: http:///
7/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 typical performance curves - continued power dissipation power dissipation(total loss) indicates the power that can be consu med by ic at t a =25c(normal temperature). ic is heated when it consumed power, and the temperature of ic chip beco mes higher than ambient temperature. the temperature that can be accepted by ic chip depends on circuit configura tion, manufacturing process, and consumable power is limi ted. power dissipation is determined by the temperature allowed in ic chip(maximum junction temperature) and thermal resistance of package(heat dissipation capability). the max imum junction temperature is typically equal to the maxim um va lue in the storage temperature range. heat generated by consu med power of ic radiates from the mold resin or lead frame of the package. the parameter which indicates this hea t dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol ja (c /w ).the temperature of ic inside the package can be estimated by this thermal resistance. figure 11 shows the model of thermal resistance of the package. therm al resistance ja , ambient temperature t a , maximum junction temperature t jmax , and power dissipation p d can be calculated by the equation below: ja = (t jmax -t a ) / p d (c /w ) derating curve in figure 12 indicates power that can be consu med by ic with reference to ambient temperature. power that ca n be consumed by ic with reference to ambient temperature. po wer that can be consumed by ic begins to attenuate at certain ambient temperature. this gradient is determined by thermal resistance ja . thermal resistance ja depends on chip size, power consumption, package, ambient temperatu re, package condition, wind velocity, etc even when the s ame of package is used. thermal reduction curve indicates a reference v alue measured at a specified condition. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [ ] power dissipation [w] figure 10 . h to l propagation delay time t p hl figure 12. derating curve figure 11 . thermal resistance ?? ta [ ] ? ? tj [ ] M p [w] ambient temperature t a (c) chip surface temperature t j (c) power dissipation p d (w) ja =(t jmax -t a )/p d (c /w ) figure 9 . l to h propagation delay time t p lh 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] v dd =3v v dd =5v v dd =16v v dd =10v operating temperature range 0 50 100 150 200 250 -50 -25 0 25 50 75 100 ambient temperature [c] propagation delay time [ns] v dd =3v v dd =5v v dd =16v v dd =10v operating temperature range ambient temperature [c] 85 bu4s81g2 (ssop5) downloaded from: http:///
8/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 i/o equival en t circuit port number input ports output ports 1,2 4 equivalent circuit operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitanc e value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small- signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the cond itions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ic s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. vdd gnd vdd gnd vdd vdd gnd gnd vss vss vss vss vdd vdd vdd vdd downloaded from: http:///
9/ 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 operational notes C continued 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos tran sistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spec ified, unused input pins should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitabl y formed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutu al interference among circuits, operational faults, or physi cal damage. therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoid ed. furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the ic. even i f the power supply voltage is applied, make sure that th e input pins have voltages within the values specified in the e lectrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). downloaded from: http:///
10 / 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 ordering information b u 4 s 8 1 g 2 - xx part number. package g2 : ssop5 packaging and forming specification tr : embossed tape and reel tl : embossed tape and reel marking diagrams part number marking ssop5(top view) lot number i 2 downloaded from: http:///
11 / 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 physical dimension, tape and reel information package name ssop5 downloaded from: http:///
12 / 12 tsz02201-0rdr0gz00200-1-2 ? 20 14 rohm co., ltd. all rights reserved. 30.sep.2015 rev.002 www.rohm.com tsz22111 ? 15 ? 001 bu4s81 g2 revision history date revision changes 03 .jun.2014 001 new release 30 .sep.2015 002 correction of the typical performance curves downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (specific applications), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hms products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohms products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.001 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohms internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice C we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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